A full-spectrum solution spanning semiconductor equipment, packaging materials, facility energy-saving ESG measures, equipment parts and solder-bar recycling. With materials engineering at our core, we work alongside your production line to achieve stable supply and greater efficiency.
PRODUCT LINES
With materials engineering at our core, we deliver complete solutions from wafer packaging and facility energy-saving measures to DIP wave-soldering — including custom alloys and long-term supply agreements tailored to your line.
SEMICONDUCTOR PACKAGING
Consumables and components for advanced packaging — covering wafer dicing, packaging substrates, conductive adhesives and precision machined metal parts.
FACILITY · ENERGY · ESG
Passive air-conditioning energy savers and power-free static guns deliver continuous savings for facility HVAC and processes, helping you reach ESG carbon-reduction goals.
SOLDER BAR · TIN RECYCLING
Supply of SAC305 / SAC0307 / SAC300 alloy solder bars, plus recycling and circular solutions for tin ingots and primary/secondary tin dross.
ABOUT KASOR
Kasor Tech Co., Ltd. was founded in 2024 and is headquartered in Kaohsiung, focusing on the supply and technical integration of semiconductor packaging materials, facility energy-saving ESG measures and DIP-process materials.
We believe material quality determines process stability. From incoming raw materials through production to shipment, we apply three-stage inspection with full lot traceability — and help customers reach long-term goals in custom alloys, tin-dross recycling and facility energy savings.
CONTACT
Share your line details and target specs, and we'll arrange a technical contact and quote within 24 hours. Call, email or book an on-site visit anytime.
